Cencorp offers a wide range of solutions for standard and custom semi-conductor automation.
We can provide solutions for module/IC Pick-and-Place, IC process handling, wafer handling and packaging process equipment.
Cencorp semi-conductor automation is designed to make the semi-conductor packaging process smoother and more efficient.
We provide high-speed and high-accuracy solutions using a sophisticated motion control platform, vision solutions and the AMP SW platform.
Our robots and nozzle heads can be adapted to many different tray layouts and module sizes.
We also provide product traceability and data analysis for equipment and factory.